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湾区物道
深圳市物联网产业协会的精品栏目《湾区物道》系列访谈，对话专家学者、政府官员、湾区商会协会及企业家，解读和宣传扶持政策；分析市场产业技术发展情况；助力物联网生态体系建设。
当前半导体技术正从产业 “支撑者” 加速转变为 “驱动者”，成为破解工业自动化升级、楼宇场景协同、机器人自主化等核心需求的关键变量。与此同时，系统可靠性、功能安全与网络安全的三重挑战，也让半导体芯片级设计与安全策略成为产业高质量发展的 “必修课”。
这是『湾区物道』的第68期，本期访谈我们对话了深圳市物联网产业协会理事单位意法半导体研发(深圳）有限公司智能工业部门的全球负责人 Allan Lagasca，本次采访，Allan深入分享了ST在半导体产业中的布局及其对未来发展的独到见解，希望给企业带来更多启发和价值。
Allan Lagasca ST 智能工业部门的全球负责人
? Allan Lagasca 是智能工业部门的全球负责人，并推动了意法半导体机器人部门战略计划的战略。
Allan Lagasca is Global leader of Smart Industrials Segment organization and driving the strategy of the Robotics Segment Strategic Program in STMicroelectronics.
? Allan 于2003年加入意法半导体，最初担任台湾地区高级应用工程师。2011年晋升为区域应用工程经理，负责IPD公司在中国大陆、南亚及印度地区的应用工程团队。2014年调任深圳，出任系统工程与战略项目应用总监，至今仍担任该职。其团队业务版图持续扩展，涵盖工业自动化与机器人技术、智能家居与楼宇自动化领域，并逐步拓展至医疗健康系统。艾伦的职业生涯始于艾斯特克/艾默生公司，在电子与半导体行业积累了超过25年的丰富经验。
Allan joined STMicroelectronics in 2003 as a Senior Application Engineer in Taiwan and moving up the ladder as regional FAE manager in 2011 covering the Greater China, South Asia and India FAE team for IPD. In 2014, He moved to Shenzhen and became Application Director of the System Engineering and Strategic Programs. He holds the position of Application Director to date with the team increasing its presence in Industrial Automation and Robotics, Smart Home & Building Automation and expanding to Medical and Healthcare systems. Allan started his career in Astec/Emerson with career experience of more than 25 years in Electronics and Semiconductor Industry.
? 今年三月，他荣获CAIMRS（中国自动化与智能制造研究峰会）颁发的2024-25年度创新大奖“年度人物”称号。
He was recently named “The Person of the Year” 2024-25 in the Innovation Award category by CAIMRS(China Automation and Intelligent Manufacturing Research Summit) in March.
1、在推动工业4.0智能化升级中，半导体技术正从“支撑者”向“驱动者”转变。请您从意法半导体的视角，分享贵公司在工业自动化与智能制造中比较有突破性的技术方案?
In promoting the intelligent upgrade of Industry 4.0, semiconductor technology is transitioning from being a supporter to a driving force. From STMicroelectronics’ perspective, could you share some of your company’s breakthrough solutions in industrial automation and smart manufacturing?
〖Allan Lagasca〗：意法半导体（ST）正在积极推动工业4.0的智能升级，利用其先进的半导体技术，在工业自动化和智能制造领域从支撑角色转变为真正的推动者和创新者。除了产品创新投资之外，意法半导体还通过引入细分市场战略计划，通过系统级方案策略，积极推动工业自动化和智能制造的转型。
意法半导体目前可提供在工业自动化的IO-Link主从站全套方案，以及机器人的关节模组和灵巧手，可编程逻辑控制器/运动控制器等完整的解决方案，并已经在市场上得到验证。
STMicroelectronics (ST) is actively driving the intelligent upgrade of Industry 4.0 by leveraging its advanced semiconductor technologies to move from a supporting role to a true enabler and innovator in industrial automation and smart manufacturing. On top of product innovation investments, STMicroelectronics is driving the transformation of industrial automation and smart manufacturing through a system-level approach with the introduction of Segment Strategic Programs.
STMicroelectronics can currently offer a full - set solution for IO - Link master and slave stations in industrial automation, as well as complete solutions like robotic joint modules, dexterous hands, and programmable logic controllers/motion controllers. And these solutions have been verified in the market.
2、楼宇自动化正从“单点控制”迈向“全场景智能协同”，涉及能源管理、环境感知、安防联动等多个维度。意法半导体在楼宇自动化中多功能，多品牌融合及节能高效，推动可持续发展方面有哪些创新布局？如何平衡高性能与低能耗、成本之间的挑战？
Building automation is evolving from “single-point control” to “intelligent collaboration across all scenarios,” involving energy management, environmental sensing, and security integration, among other aspects. How is STMicroelectronics innovating in multifunctional integration, multi-brand interoperability, and energy efficiency to promote sustainable development in building automation? How do you balance the challenges of high performance, low power consumption, and cost?
〖Allan Lagasca〗：新楼宇自动化正在打破品牌壁垒，从单点控制演变为跨各种场景的智能协作，包括能源管理、环境感知和安全集成。意法半导体通过提供 KNX 系统和无线 Matter 技术等综合解决方案来推动楼宇自动化领域的创新，这些解决方案可实现无缝的多功能集成和多品牌互作性，确保设备之间的高效通信，培育互联的智能生态系统，从而推动楼宇自动化从“单点控制”向“全场景智能协同”的演进。
同时， 意法半导体利用先进的微控制器、传感器、功率器件和边缘人工智能技术来满足楼宇自动化的多样化需求。例如，意法半导体的微控制器提供高性能处理能力，同时保持低功耗，确保节能系统的最佳运行。意法半导体的传感器可以实现精确的环境监测，例如温度、光照度、人员存在等，这对于创造舒适和可持续的生活空间至关重要。
为了应对高性能、低功耗和成本效益等挑战，意法半导体采用尖端半导体技术，包括全球标准的有线及无线通讯方案、超低功耗微控制器、高效电源管理IC和先进的MEMS传感器等。这些技术旨在优化能源使用、降低运营成本并确保长期可靠性，符合楼宇自动化可持续发展的目标。
New building automation is breaking brand barriers, evolving from single-point control to intelligent collaboration across various scenarios, including energy management, environmental sensing, and security integration. STMicroelectronics drives innovation in the building automation domain by offering comprehensive solutions such as KNX systems and wireless Matter technology. These solutions enable seamless multifunctional integration and multi-brand interoperability, ensuring efficient communication between devices and fostering a connected intelligent ecosystem, thereby advancing building automation from "single-point control" to "full-scenario intelligent collaboration."
Additionally, STMicroelectronics leverages advanced microcontrollers, sensors, power devices, and edge-AI technologies to meet the diverse needs of building automation. For instance, STMicroelectronics' microcontrollers provide high-performance processing capabilities while maintaining low power consumption, ensuring optimal operation of energy-saving systems. Its sensors enable precise environmental monitoring, such as temperature, illuminance, and human presence, which are crucial for creating comfortable and sustainable living spaces.
To address challenges such as high performance, low power consumption, and cost efficiency, STMicroelectronics employs cutting-edge semiconductor technologies, including globally standardized wired and wireless communication solutions, ultra-low-power microcontrollers, efficient power management ICs, and advanced MEMS sensors. These technologies are designed to optimize energy usage, reduce operational costs, and ensure long-term reliability, aligning with the sustainable development goals of building automation.
3、机器人产业正处于爆发前夜，无论是工业机械臂、AGV，还是服务机器人，都对高精度感知、实时控制和安全运行提出极高要求。意法半导体在机器人核心元器件方面有哪些技术突破？如何支持机器人实现更灵活、更安全、更自主的运行？
The robotics industry is on the verge of rapid expansion. Whether in industrial robotic arms, AGVs, or service robots, extremely high demands are placed on precision sensing, real-time control, and safe operation. What breakthroughs has STMicroelectronics achieved in core robotic components? How do you enable robots to operate with greater flexibility, safety, and autonomy?
〖Allan Lagasca〗：意法半导体 （ST） 在核心机器人组件方面取得了重大进展，以满足工业机械臂、自动导引车 （AGV） 和服务机器人等机器人应用中对精密传感、实时控制和安全作日益增长的需求。
关键技术突破：
1.高精度传感和MEMS技术的领导地位
意法半导体的MEMS部门是机器人战略的核心。公司持续投资于MEMS技术和产品，加强与大学、工具供应商和设备制造商的合作。这种方法确保了MEMS传感器（如加速度计、陀螺仪和环境传感器）的协同发展，这些传感器对于机器人中精确的运动检测、方向感知和环境感知至关重要。这些传感器使机器人能够实现高水平的精度和响应能力，这对于灵活和自主操作至关重要。
2.实时控制与电源管理
意法半导体开发了广泛的电源管理芯片（PMIC）、电机驱动器和定制模拟芯片，这些对于机器人执行器和电机的实时控制至关重要。这些组件确保了高效的能源利用、精确的控制和可靠的运行，这些都是包括自动导引车（AGV）和工业机械臂在内的机器人系统安全自主运动的基础。
3.工业环境中的安全与自主化
意法半导体通过稳健的产品设计和严格的质量控制来解决机器人作的安全性问题。
4.工业4.0的集成
AGV（自动导引车）和ARV（自动机器人车辆）都被认为是工业4.0的重要组成部分，体现了意法半导体对智能制造和数字化转型的承诺。通过提供核心组件和系统级专业知识，意法半导体推动了灵活、自主和互联机器人解决方案在工业环境中的应用。
总结来说，意法半导体通过先进的MEMS传感器、强大的电源管理和控制集成电路，以及对安全性和工业4.0集成的高度关注，赋能机器人行业。这些创新共同使机器人能够在各种工业和服务应用中实现更高的灵活性、安全性和自主性。
STMicroelectronics (ST) has made significant advancements in core robotic components to address the growing needs for precision sensing, real-time control, and safe operation in robotics applications such as industrial robotic arms, Automatic Guided Vehicles (AGVs), and service robots.
ST’s MEMS Sub-Group is central to its strategy for robotics. The company continues to invest in MEMS technology and products, strengthening collaborations with universities, tool suppliers, and equipment manufacturers. This approach ensures synergistic development of MEMS sensors—such as accelerometers, gyroscopes, and environmental sensors—that are critical for precise motion detection, orientation, and environmental awareness in robots. These sensors enable robots to achieve high levels of accuracy and responsiveness, which are essential for flexible and autonomous operation.
ST develops a wide range of power management ICs (PMICs), motor drivers, and custom analog ICs that are vital for the real-time control of robotic actuators and motors. These components ensure efficient energy use, precise control, and reliable operation, which are fundamental for the safe and autonomous movement of robotic systems, including AGVs and industrial arms.
3. Safety and Autonomy in Industrial Environments
ST addresses the safety of robotic operations through robust product design and stringent quality control.
Both AGVs and ARVs (Automatic Robot Vehicles) are recognized as integral parts of Industry 4.0, reflecting ST’s commitment to smart manufacturing and digital transformation. By providing the core components and system-level expertise, ST enables the deployment of flexible, autonomous, and interconnected robotic solutions across industrial settings.
In summary, STMicroelectronics empowers the robotics industry with advanced MEMS sensors, robust power management and control ICs, and a strong focus on safety and integration with Industry 4.0. These innovations collectively enable robots to operate with greater flexibility, safety, and autonomy in diverse industrial and service applications.
4、工业与楼宇场景对系统安全、功能安全和网络安全的要求日益严格。意法半导体如何通过芯片级设计保障系统可靠性？在应对网络攻击和数据泄露方面有何前瞻布局？
Industrial and building automation scenarios increasingly demand stringent system reliability, functional safety, and cybersecurity. How does STMicroelectronics ensure system reliability through chip-level design? What forward-looking strategies have you implemented to address cybersecurity threats and data protection?
〖Allan Lagasca〗：意法半导体通过从芯片设计层面开始扩展到组织战略和流程的综合方法，确保工业和楼宇自动化中的系统可靠性、功能安全和网络安全。
在芯片设计层面确保系统可靠性
质量管理体系（QMS）：意法半导体运营全公司范围内的质量管理体系，符合IATF 16949：2016（包括 ISO 9001：2015 和汽车行业技术规范）等严格标准。该系统确保所有产品（包括工业和楼宇自动化产品）的设计和制造都能满足高可靠性和安全要求。质量管理体系通过绩效指标、内部审计和管理审查不断改进，重点关注风险分析和根本原因分析，以推动纠正措施和持续改进。
可靠性和安全性设计：意法半导体的芯片设计流程采用了最佳实践，以确保可靠性和功能安全。这包括遵守客户特定要求和国际标准，以及部署强大的设计方法和验证流程。该公司的质量手册及其附录详细说明了如何在所有实体和产品线中实施这些实践。
网络安全和数据保护的前瞻性战略
全面的安全政策：意法半导体的安全政策涵盖对员工、资产和信息的保护，包括存储、处理和传输公司和第三方机密信息的计算机系统和数字解决方案。
信息安全管理：意法半导体的信息安全管理旨在保护信息和设备的机密性、完整性和可用性。
安全风险管理：意法半导体建立了安全风险管理流程，该流程不断应用和更新，以应对不断变化的威胁。
总之，意法半导体通过强大的质量管理和设计实践确保系统可靠性，同时通过全面的政策、风险管理流程和专门的安全组织主动解决网络安全和数据保护问题。
STMicroelectronics ensures system reliability, functional safety, and cybersecurity in industrial and building automation through a comprehensive approach that starts at the chip design level and extends to organizational strategies and processes.
Ensuring System Reliability at the Chip Design Level
?Quality Management System (QMS): ST operates a company-wide QMS that is compliant with rigorous standards such as IATF 16949:2016 (which includes ISO 9001:2015 and automotive industry technical specifications). This system ensures that all products, including those for industrial and building automation, are designed and manufactured to meet high reliability and safety requirements. The QMS is continuously improved through performance indicators, internal audits, and management reviews, with a strong focus on risk analysis and root cause analysis to drive corrective actions and continuous improvement.
? Design for Reliability and Safety: ST’s chip design process incorporates best practices to ensure reliability and functional safety. This includes compliance with customer-specific requirements and international standards, as well as the deployment of robust design methodologies and validation processes. The company’s quality manual and its addenda detail how these practices are implemented across all entities and product lines.
Forward-Looking Strategies for Cybersecurity and Data Protection
? Comprehensive Security Policy: ST’s Security Policy covers the protection of employees, assets, and information—including computer systems and digital solutions that store, process, and transmit both company and third-party confidential information.
?Information Security Management: ST’s Information Security Management is designed to preserve the confidentiality, integrity, and availability of information and devices.
?Security Risk Management: ST has established a Security Risk Management process that is continuously applied and updated in response to evolving threats.
In summary, STMicroelectronics ensures system reliability through robust quality management and design practices, while proactively addressing cybersecurity and data protection with comprehensive policies, risk management processes, and a dedicated security organization.
5、面向未来，您认为半导体产业将面临哪些关键机遇与挑战？意法半导体将如何与中国生态伙伴协同创新，共同推动本土智能化产业升级？
Looking ahead, what key opportunities and challenges do you foresee for the semiconductor industry? How will STMicroelectronics collaborate with Chinese ecosystem partners to jointly promote the upgrading of local intelligent industries?
〖Allan Lagasca〗：
半导体行业的主要机遇
1.对先进技术的需求不断增长
? 人工智能、5G/6G、物联网、自动驾驶汽车和边缘计算的增长推动了对先进半导体解决方案的需求。
? 对具有更高性能、更低功耗和增强集成度的芯片的需求不断增加。
2.智能和互联设备的扩展
? 智能家居、可穿戴设备、工业自动化和智慧城市的激增创造了多样化的半导体应用。
? 在传感器、微控制器和连接芯片方面进行创新的机会。
3.新材料和新工艺的出现
? 采用新型半导体材料（例如碳化硅、氮化镓）用于电力电子和射频应用。
? 封装技术的进步使芯片更加强大和紧凑。
4.可持续性和能源效率
? 越来越重视绿色技术和节能半导体。
? 有机会在环保芯片设计和制造工艺方面处于领先地位。
半导体行业面临的主要挑战
1.先进制造的复杂性和成本
? 增加尖端节点的研发和资本支出。
? 平衡成本、产量和上市时间压力。
2.人才短缺
? 半导体设计和制造领域对熟练工程师和研究人员的需求量很大。
? 需要持续培训和人才发展。
3.快速的技术变革
? 快速创新周期需要敏捷性和持续投资。
? 技术过时的风险和知识产权挑战。
意法半导体如何与中国生态系统合作伙伴合作
1.联合研发和创新举措
? 建立以人工智能芯片、电力电子、智能传感器为重点的联合创新中心。
? 与当地大学和研究机构合作，开发适合中国市场需求的尖端半导体技术。
2.智能产业定制化解决方案
? 定制产品以满足中国市场的特定监管、环境和性能要求。
3.生态系统建设和人才培养
? 参与中国半导体产业联盟和标准组织。
? 支持培训计划、实习和技术转让计划，以培养当地人才和专业知识。
4.可持续发展与绿色技术合作
? 共同开发节能半导体产品和可持续制造工艺。
? 在当地生态系统内促进循环经济实践和负责任的采购。
Key Opportunities for the Semiconductor Industry
1.Rising Demand for Advanced Technologies
? Growth in AI, 5G/6G, IoT, autonomous vehicles, and edge computing drives demand for advanced semiconductor solutions.
? Increasing need for chips with higher performance, lower power consumption, and enhanced integration.
2.Expansion of Smart and Connected Devices
? Proliferation of smart homes, wearables, industrial automation, and smart cities creates diverse semiconductor applications.
? Opportunity to innovate in sensors, microcontrollers, and connectivity chips.
3.Emergence of New Materials and Processes
? Adoption of new semiconductor materials (e.g., SiC, GaN) for power electronics and RF applications.
? Advances in packaging technologies enable more powerful and compact chips.
4.Sustainability and Energy Efficiency
?Growing emphasis on green technologies and energy-efficient semiconductors.
? Opportunity to lead in eco-friendly chip design and manufacturing processes.
Key Challenges for the Semiconductor Industry
1.Complexity and Cost of Advanced Manufacturing
? Increasing R&D and capital expenditure for cutting-edge nodes.
? Balancing cost, yield, and time-to-market pressures.
2.Talent Shortage
? High demand for skilled engineers and researchers in semiconductor design and manufacturing.
? Need for continuous training and talent development.
3.Rapid Technological Changes
? Fast innovation cycles require agility and continuous investment.
?Risk of technology obsolescence and intellectual property challenges.
How STMicroelectronics Can Collaborate with Chinese Ecosystem Partners
1. Joint R&D and Innovation Initiatives
? Establish joint innovation centers focusing on AI chips, power electronics, and smart sensors.
? Collaborate with local universities and research institutes to develop cutting-edge semiconductor technologies tailored to Chinese market needs.
2. Customized Solutions for Intelligent Industries
? Tailor products to meet specific regulatory, environmental, and performance requirements of the Chinese market.
3. Ecosystem Building and Talent Development
? Participate in Chinese semiconductor industry alliances and standards organizations.
? Support training programs, internships, and technology transfer initiatives to nurture local talent and expertise.
4. Sustainability and Green Technology Collaboration
?Jointly develop energy-efficient semiconductor products and sustainable manufacturing processes.
? Promote circular economy practices and responsible sourcing within the local ecosystem.
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